Dongwook Kim, P. Bhimaraj, N. Watts, Y. Isao, C. Kumar, Youren Xu
{"title":"评价DIG(直接浸金)作为一种新的移动应用表面处理","authors":"Dongwook Kim, P. Bhimaraj, N. Watts, Y. Isao, C. Kumar, Youren Xu","doi":"10.1109/ECTC.2006.1645656","DOIUrl":null,"url":null,"abstract":"DIG (direct immersion gold) is evaluated as an alternative surface finish solution to Ni/Au system for mobile electronics. Three key points are studied in this paper. First, Au capping layer optimization was studied. At least 0.14mum Au thickness is needed to prevent Cu out-diffusion and achieve reasonable assembly process window. Second, compared interfacial microstructures and morphologies of IMCs formed on DIG and Ni/Au surface finishes. DIG provide uniform IMC layer with no void, defect and Au-Sn intermetallic compounds (IMC). Finally, reliability and fracture modes were studied. SAC 405 performs better than eutectic Pb-Sn for the temperature cycling test. Crack in Pb-Sn + DIG system is initiated from interface of Cu6Sn5 and bulk solder and propagated to bulk solder while crack path of Pb-Sn + Electrolytic Ni/Au is interface of Au-Sn IMC and bulk solder. For drop test, SAC405 + DIG system has mix fracture modes of bulk and IMC brittle fracture while SAC405 + electrolytic Ni/Au has shows complete IMC fracture mode","PeriodicalId":194969,"journal":{"name":"56th Electronic Components and Technology Conference 2006","volume":"23 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-07-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":"{\"title\":\"Evaluation of DIG (direct immersion gold) as a new surface finishes for mobile applications\",\"authors\":\"Dongwook Kim, P. Bhimaraj, N. Watts, Y. Isao, C. Kumar, Youren Xu\",\"doi\":\"10.1109/ECTC.2006.1645656\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"DIG (direct immersion gold) is evaluated as an alternative surface finish solution to Ni/Au system for mobile electronics. Three key points are studied in this paper. First, Au capping layer optimization was studied. At least 0.14mum Au thickness is needed to prevent Cu out-diffusion and achieve reasonable assembly process window. Second, compared interfacial microstructures and morphologies of IMCs formed on DIG and Ni/Au surface finishes. DIG provide uniform IMC layer with no void, defect and Au-Sn intermetallic compounds (IMC). Finally, reliability and fracture modes were studied. SAC 405 performs better than eutectic Pb-Sn for the temperature cycling test. Crack in Pb-Sn + DIG system is initiated from interface of Cu6Sn5 and bulk solder and propagated to bulk solder while crack path of Pb-Sn + Electrolytic Ni/Au is interface of Au-Sn IMC and bulk solder. For drop test, SAC405 + DIG system has mix fracture modes of bulk and IMC brittle fracture while SAC405 + electrolytic Ni/Au has shows complete IMC fracture mode\",\"PeriodicalId\":194969,\"journal\":{\"name\":\"56th Electronic Components and Technology Conference 2006\",\"volume\":\"23 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2006-07-05\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"7\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"56th Electronic Components and Technology Conference 2006\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.2006.1645656\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"56th Electronic Components and Technology Conference 2006","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2006.1645656","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Evaluation of DIG (direct immersion gold) as a new surface finishes for mobile applications
DIG (direct immersion gold) is evaluated as an alternative surface finish solution to Ni/Au system for mobile electronics. Three key points are studied in this paper. First, Au capping layer optimization was studied. At least 0.14mum Au thickness is needed to prevent Cu out-diffusion and achieve reasonable assembly process window. Second, compared interfacial microstructures and morphologies of IMCs formed on DIG and Ni/Au surface finishes. DIG provide uniform IMC layer with no void, defect and Au-Sn intermetallic compounds (IMC). Finally, reliability and fracture modes were studied. SAC 405 performs better than eutectic Pb-Sn for the temperature cycling test. Crack in Pb-Sn + DIG system is initiated from interface of Cu6Sn5 and bulk solder and propagated to bulk solder while crack path of Pb-Sn + Electrolytic Ni/Au is interface of Au-Sn IMC and bulk solder. For drop test, SAC405 + DIG system has mix fracture modes of bulk and IMC brittle fracture while SAC405 + electrolytic Ni/Au has shows complete IMC fracture mode
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
