优化控制栅材料和结构,提高20nm 64Gb NAND闪存可靠性

Haesoo Kim, Kangbin Lee, K. Han, Seokwon Cho, Se Kyoung Choi, S. Seo, J. Chung, K. Lee, Sungjae Chung, K. Noh, Tae-Un Youn, Ju Yeab Lee, Min Kyu Lee, B. Han, S. M. Yi, H. Lee, Sung Soon Kim, W. S. Shin, K. Yun, M. Ko, J. Choi, Sang Wan Lee, Sang Deok Kim, Myung Kyu Ahn, Ki Seog Kim, Y. Jeon, Sung Kye Park, S. Aritome, Jin Woong Kim, Sang Sun Lee, S. Lee, K. Ahn, Sung-Joo Hong, G. Bae, S. Park
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引用次数: 1

摘要

我们开发了新的控制门(CG)材料和结构,以克服超过20nm NAND闪存单元的缩放限制。新型CG材料可以实现良好的无空隙填充,改善栅极CD间隙(GCG)。同时,采用新型的CG材料可以改善浮栅之间的CG损耗。从而大大改善了栅极耦合比、位线干扰和尾单元Vt分布。这些技术对扩展NAND闪存单元的特性和可靠性起着重要的作用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Optimization of control gate material and structure for enhancing 20nm 64Gb NAND flash reliability
We developed the new control gate (CG) material and structure in order to overcome scaling limitation beyond 20nm NAND flash cell. New CG material can achieve excellent gap-fill without void and improvement of the Gate CD Gap (GCG). And also, by using new CG material, CG depletion between floating gate (FG) can be improved. As a result, gate coupling ratio, bit-line (BL) interference and tail-cell Vt distribution are drastically improved. These technologies play an important role in the characteristic of scaled NAND flash memory cell and reliability.
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