极低电压可操作的片上等离子体诱发损伤监测测试电路,采用高灵敏度环式vco(压控振荡器)

Manabu Tomita, S. Mori, Y. Fukuzaki, K. Ogawa, S. Miyake, H. Ohnuma
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引用次数: 0

摘要

我们开发了一种片上监测测试电路,在低Vdd工作条件下,采用一种新型的环形电压控制振荡器(ring - VCO)来测量晶圆过程中等离子体诱导损伤(PID)引起的Vth波动。该电路可以很容易地实现常规设计和应用于产品测试。我们已经证明,采用28nm工艺制作的电路可以在工作电压为0.5V时监测由PID引起的Vth波动,可用于28nm CMOS技术及以后的低功耗物联网产品。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Extremely Low Voltage Operatable On-Chip- Monitor-Test Circuit for Plasma Induced Damage using High sensitivity Ring-VCO(Voltage Controlled Oscillator)
We developed an on-chip-monitor-test circuit that measures Vth fluctuation caused by plasma induced damage (PID) during wafer process with using a novel ring voltage controlled oscillator (Ring- VCO) at low Vdd operation condition. The circuit can be easily implemented to conventional design and applied to product test. We have demonstrated that the circuit fabricated by 28nm process can monitor Vth fluctuation due to PID with operating voltage at 0.5V, which can be used for low power IoT products by 28nm CMOS technology and beyond.
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