Non-destructive method of shear stress test by new test structure

A new test structure was developed for a nondestructive method. The purpose of this test structure is to detect the influence of thermomechanical stress between silicon chip and plastic resin. In this structure, detection of the failure is very easy, because the influence of thermomechanical stress can be detected electrically. By using this new structure, the following results were found: (1) Dependence on chip size; (2) Influence of layout of package; (3) Acceleration between heat shock and temperature cycle tests.