Ag薄膜在空气中原子扩散键合的初步研究

2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2021-10-05 DOI:10.1109/LTB-3D53950.2021.9598421

Y. Watabe, F. Goto, M. Uomoto, T. Shimatsu

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引用次数: 1

摘要

本研究评估了室温下银薄膜在空气中的原子扩散键合(ADB)。通过改善Ag薄膜和下层Ti薄膜的结构质量，我们实现了在空气中的键合。Ag-Ag键合界面发生了显著的晶格重排。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Preliminary Study of Atomic Diffusion Bonding in Air using Ag films

This study assessed atomic diffusion bonding (ADB) of wafers at room temperature in air using Ag films. By improving structural qualities of Ag films and underlayered Ti films, we achieved bonding in air. Remarkable crystal lattice rearrangement occurred at the Ag–Ag bonded interface.

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来源期刊

2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

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