{"title":"x射线能量色散分析在半导体塑料封装中的应用","authors":"G. Riga, P. Tang","doi":"10.1109/IRPS.1979.362895","DOIUrl":null,"url":null,"abstract":"The plastic used in semiconductor packages can be readily characterized for filler and fire retardant content by X-ray-ED analysis. The technique can be used to monitor lot to lot process variations as well as uniformity of molded parts. It can be applied in incoming quality control as a quality indicator of the non polymerized plastic or the finished product. Reliability test failures can be analyzed to insure their identification, to measure the degree of surface contamination, or to perform correlation studies.","PeriodicalId":161068,"journal":{"name":"17th International Reliability Physics Symposium","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1979-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Applications of X-Ray Energy Dispersive Analysis to Semiconductor Plastic Packages\",\"authors\":\"G. Riga, P. Tang\",\"doi\":\"10.1109/IRPS.1979.362895\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The plastic used in semiconductor packages can be readily characterized for filler and fire retardant content by X-ray-ED analysis. The technique can be used to monitor lot to lot process variations as well as uniformity of molded parts. It can be applied in incoming quality control as a quality indicator of the non polymerized plastic or the finished product. Reliability test failures can be analyzed to insure their identification, to measure the degree of surface contamination, or to perform correlation studies.\",\"PeriodicalId\":161068,\"journal\":{\"name\":\"17th International Reliability Physics Symposium\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1979-04-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"17th International Reliability Physics Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IRPS.1979.362895\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"17th International Reliability Physics Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IRPS.1979.362895","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Applications of X-Ray Energy Dispersive Analysis to Semiconductor Plastic Packages
The plastic used in semiconductor packages can be readily characterized for filler and fire retardant content by X-ray-ED analysis. The technique can be used to monitor lot to lot process variations as well as uniformity of molded parts. It can be applied in incoming quality control as a quality indicator of the non polymerized plastic or the finished product. Reliability test failures can be analyzed to insure their identification, to measure the degree of surface contamination, or to perform correlation studies.
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
