用于微流体应用的微机械静电驱动超声谐振器的晶圆集成阵列

B. Parviz, T. Chou, C. Zhang, K. Najafi, M. Muller, L. Bernal, P. Washabaugh
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引用次数: 10

摘要

提出了一种分布式微机械超声源。工作频率超过100khz的静电致动器与亥姆霍兹谐振器耦合,以实现高输出速度。它们由一个1200 /spl亩/米/倍/1200 /spl亩/米/倍/1.36 /spl亩/米复合隔膜、一个穿孔的p+ +背板和一个3 /spl亩/米的气隙组成。致动器覆盖4英寸晶圆的整个表面,并分为四个可单独寻址的象限。采用阳极玻璃-硅键合、溶解晶圆工艺和先进的深硅刻蚀技术,开发了一种产率高达bbb80 %的稳健微加工技术,用于制造致动器阵列。采用激光干涉法研究了膜片的动态特性,并在96 kHz声频下验证了膜片的工作特性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A wafer-integrated array of micromachined electrostatically-driven ultrasonic resonators for microfluidic applications
A distributed micromachined ultrasound source is presented. Electrostatic actuators operating at frequencies exceeding 100 kHz are coupled to a Helmholtz resonator in order to achieve high output velocities. They consist of a 1200 /spl mu/m/spl times/1200 /spl mu/m/spl times/1.36 /spl mu/m composite diaphragm, a perforated P++ backplate and a 3 /spl mu/m air gap. The actuators cover the entire surface of a 4" wafer and are grouped in four individually addressable quadrants. A robust micromachining technology with >80% yield, employing anodic glass-silicon bonding, dissolved wafer process and advanced deep silicon etching has been developed for fabrication of the actuator array. The dynamic behavior of the diaphragm was studied using laser interferometry, and operation was verified at 96 kHz by acoustic measurement.
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