下一代速度的PCB堆叠设计和优化

2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS) Pub Date : 2016-10-01 DOI:10.1109/EPEPS.2016.7835440

Chun-Lin Liao, B. Mutnury, Ching-Huei Chen, Yi-Jyun Lee

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引用次数: 6

摘要

提出了一种有效的经验仿真工具来预测耦合差分微带和带线的传输线性能。基于人工神经网络(ANN)方法预测传输线性能准确，适用于印刷电路板(PCB)堆叠设计。设计实例说明了该工具如何帮助差动带钢线结构参数的设计，并预测其随结构参数变化的性能范围。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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PCB stack-up design and optimization for next generation speeds

An efficient empirical simulation tool was presented to predict the transmission line performance of coupled differential microstrip and strip lines. Based on the Artificial Neural Network (ANN) method, the predicted transmission line performances were accurate and were suitable for printed circuit board (PCB) stack-up design. Design examples were presented how this tool helping on differential strip line structure parameters design and predicting their performance range with the structure parameters variation.

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来源期刊

2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS)

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