电力器件的铜线键合优化

2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Pub Date : 2018-07-01 DOI:10.1109/IPFA.2018.8452561

T. Pinili, R. Manolo, A. Denoyo, B. Yabut, D. Moore, B. Cowell, J. Jenson, K. Truong, J. Gambino, R. Watkins, W. Qin, G. Brizar, J. De Clerq

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引用次数: 2

摘要

我们报告了使用50.8µm (2 mil)直径的pd涂层铜线的智能电源器件的键合垫损坏。我们表明，这种损害可能相对微妙;损坏结构上的导线键具有较高的拉力和剪切强度，但底层区域的裂纹会导致金属挤压，从而导致电气短路。

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Copper Wire Bond Optimization for Power Devices

We report on bond pad damage for a smart power device using 50.8 µm (2 mil) diameter Pd-coated Cu wire. We show that the damage can be relatively subtle; the wire bonds on damaged structures have high pull and shear strength, but cracks in the underlying regions lead to metal extrusions that cause electrical shorts.

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2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

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