提出片上测试结构以量化快闪记忆体的陷阱密度

V. Verma, A. Swaneck
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引用次数: 3

摘要

由于循环导致闪存的程序/擦除特性退化是业界普遍关注的可靠性问题。这种性能的下降与存储单元电介质中存在的捕获电荷有关。提出了一种片上测试结构的实现,允许对闪存单元的捕获特性进行监测。本文讨论了片上测试结构、闪存的程序/擦除特性以及电子陷阱密度的测量。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Proposed on-chip test structure to quantify trap densities within flash meories
Degradation of the program/erase characteristics of Flash memory due to cycling is an industry wide reliability concern. This degradation in performance is associated with trapped charges present within the memory cells dielectric. The implementation of an on chip test structure is proposed, allowing trapping characteristics of the Flash memory cells to be monitored. This paper discusses the on-chip test structure, program/erase characteristics of Flash memories, and electron trap density measurements.
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