湿度循环对叠加高密度互连可靠性的影响

Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92 Pub Date : 1992-03-18 DOI:10.1109/MCMC.1992.201459

X. Shan, R. K. Agarwal, M. Pecht, J. Evans

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引用次数: 2

摘要

作者提出了一个有限元模拟，用于观察典型高密度互连结构中由于吸水引起的膨胀错配所产生的应力。他们关注的是由于湿度循环而导致介电膜脱粘和微屈曲的应力。数值分析用于研究潜在的失效部位、模式和失效机制。

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Effect of humidity cycling on reliability of overlaid high density interconnects

The authors present a finite element simulation, performed to observe the stresses generated in a typical high-density interconnect structure as a result of swelling mismatches due to water absorption. They focus on stresses which could cause de-adhesion and microbuckling of dielectric films due to humidity cycling. Numerical analysis was used to examine the potential failure sites, modes, and failure mechanisms.<>

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Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92

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