使用TDT和TDRT进行开尔文晶圆测量和封装水平测试的VF-TLP系统

2004 Electrical Overstress/Electrostatic Discharge Symposium Pub Date : 2004-09-01 DOI:10.1109/EOSESD.2004.5272811

E. Grund, R. Gauthier

{"title":"使用TDT和TDRT进行开尔文晶圆测量和封装水平测试的VF-TLP系统","authors":"E. Grund, R. Gauthier","doi":"10.1109/EOSESD.2004.5272811","DOIUrl":null,"url":null,"abstract":"Very fast transmission line pulse (VF-TLP) systems described in the literature are time domain reflection (VF-TDR) configurations. Using other TLP configurations, VF-TLP systems can provide new capabilities. A wafer level Kelvin probe system was derived from VF-time domain transmission (VF-TDT). A test fixture board (TFB) using VF-time domain reflection and transmission (VF-TDRT) enables VF-TLP package level testing.","PeriodicalId":302866,"journal":{"name":"2004 Electrical Overstress/Electrostatic Discharge Symposium","volume":"47 9 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"33","resultStr":"{\"title\":\"VF-TLP systems using TDT and TDRT for kelvin wafer measurements and package level testing\",\"authors\":\"E. Grund, R. Gauthier\",\"doi\":\"10.1109/EOSESD.2004.5272811\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Very fast transmission line pulse (VF-TLP) systems described in the literature are time domain reflection (VF-TDR) configurations. Using other TLP configurations, VF-TLP systems can provide new capabilities. A wafer level Kelvin probe system was derived from VF-time domain transmission (VF-TDT). A test fixture board (TFB) using VF-time domain reflection and transmission (VF-TDRT) enables VF-TLP package level testing.\",\"PeriodicalId\":302866,\"journal\":{\"name\":\"2004 Electrical Overstress/Electrostatic Discharge Symposium\",\"volume\":\"47 9 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2004-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"33\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2004 Electrical Overstress/Electrostatic Discharge Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EOSESD.2004.5272811\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2004 Electrical Overstress/Electrostatic Discharge Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EOSESD.2004.5272811","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 33

摘要

文献中描述的超高速传输线脉冲(VF-TLP)系统是时域反射(VF-TDR)配置。使用其他TLP配置，VF-TLP系统可以提供新的功能。利用vf -时域传输技术(VF-TDT)建立了晶圆级开尔文探针系统。使用vf -时域反射和传输(VF-TDRT)的测试夹具板(TFB)可以实现VF-TLP封装级测试。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

VF-TLP systems using TDT and TDRT for kelvin wafer measurements and package level testing

Very fast transmission line pulse (VF-TLP) systems described in the literature are time domain reflection (VF-TDR) configurations. Using other TLP configurations, VF-TLP systems can provide new capabilities. A wafer level Kelvin probe system was derived from VF-time domain transmission (VF-TDT). A test fixture board (TFB) using VF-time domain reflection and transmission (VF-TDRT) enables VF-TLP package level testing.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2004 Electrical Overstress/Electrostatic Discharge Symposium

自引率

0.00%

发文量