{"title":"基于塑料IC封装特性的测量和现场仿真","authors":"F. Mernyei","doi":"10.1109/EPEP.1997.634066","DOIUrl":null,"url":null,"abstract":"A method to obtain electrical models for IC packages is introduced. We used measured S-parameters to extract equivalent circuits for the package and surrounding components. The resulted equivalent circuit was verified with 3D field simulation.","PeriodicalId":220951,"journal":{"name":"Electrical Performance of Electronic Packaging","volume":"41 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":"{\"title\":\"Measurement and field simulation based characterization of plastic IC packages\",\"authors\":\"F. Mernyei\",\"doi\":\"10.1109/EPEP.1997.634066\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A method to obtain electrical models for IC packages is introduced. We used measured S-parameters to extract equivalent circuits for the package and surrounding components. The resulted equivalent circuit was verified with 3D field simulation.\",\"PeriodicalId\":220951,\"journal\":{\"name\":\"Electrical Performance of Electronic Packaging\",\"volume\":\"41 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-10-27\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"7\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Electrical Performance of Electronic Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.1997.634066\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrical Performance of Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.1997.634066","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Measurement and field simulation based characterization of plastic IC packages
A method to obtain electrical models for IC packages is introduced. We used measured S-parameters to extract equivalent circuits for the package and surrounding components. The resulted equivalent circuit was verified with 3D field simulation.
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