掺硼金刚石(100)薄膜深度缺陷高灵敏度瞬态光电容测量系统的研制

Kenta Miyawaki, R. Yamashita, Taishi Kodama, O. Maida
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引用次数: 0

摘要

我们开发了一种高灵敏度的瞬态光电容测量系统,用于测量宽禁带材料的深度缺陷,并将其应用于高功率密度微波等离子体化学气相沉积法在高压/高温合成的Ib金刚石衬底上生长的掺硼金刚石薄膜。所开发的瞬态光电容测量系统对光电容变化的检测限小于0.5 fF,并且在12 h内的测量温度漂移小于0.03 K。通过使用该瞬态光电容测量系统,我们成功地在b掺杂金刚石薄膜的价带最大值上方约1.2 eV处发现了受体型缺陷。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Development of Highly-Sensitive Transient Photocapacitance Mesurement System for Deep Defects in Boron-Doped Diamond (100) Films
We have developed a highly-sensitive transient photocapacitance measurement system for deep defects in wide bandgap materials, and applied it to characterize the boron-doped diamond films grown on a high-pressure/high-temperature-synthesized Ib diamond substrate using high-power-density microwave-plasma chemical vapor deposition method. The developed transient photocapacitance measurement system has both a low detection limit of less than 0.5 fF for changes in the photocapacitance and a low measurement temperature drift of less than 0.03 K in 12 h. By using the transient photocapacitance measurement system, we have successfully found an acceptor-type defect around 1.2 eV above the valence band maximum for the B-doped diamond film.
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