完全依赖于固化的聚合物建模及其在qfn封装翘曲中的应用

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) Pub Date : 2004-12-08 DOI:10.1109/EPTC.2004.1396582

D.G. Yang, L. Ernst, K. Jansen, C. van't Hof, G.Q. Zhang, W. V. van Driel, H. Bressers

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引用次数: 5

摘要

工艺引起的翘曲是影响包装可靠性的一个重要问题。为了模拟QFN封装成型过程中产生的翘曲，本文讨论了模型成型化合物的完整实验材料表征。通过间歇固化实验的方法，得到了主曲线以及“温度位移因子”和“转换位移因子”。对QFN基带进行了一系列模塑实验。在成型过程中，采用不同的成型温度/时间和后固化/时间组合。分别测量了成型后和固化后的翘曲量。结果表明，填充料用量和模具厚度对翘曲水平均有显著影响。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Fully cure-dependent polymer modeling and application to QFN-packages warpage

Process-induced warpage is an important issue for package reliability. In order to model the warpage generated during the molding process of QFN packages, a full experimental material characterization of model molding compounds is discussed in This work. Through a method of intermittent cure experiment, the master curve and both a "temperature shift factor" and a "conversion shift factor" are obtained. A series of molding experiments for QFN matrix strips with the model-molding compounds were performed. In the molding process, different combinations of molding temperature/time and post-cure/time were used. The warpage after molding and after post-cure was measured, respectively. The results show that both the filler percentage and the die thickness have significant effects on the warpage level.

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Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)

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