通过模具互连扇形圆片级封装

2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) Pub Date : 2016-11-01 DOI:10.1109/EPTC.2016.7861441

S. W. Ho, L. Wai, S. A. Sek, Daniel Ismael Cereno, B. L. Lau, H. Hsiao, T. Chai, V. S. Rao

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引用次数: 6

摘要

通过模具互连(TMI)是扇出晶圆级封装(FOWLP) 3D集成的关键促成因素。针对模具优先和rdl优先制造流程，开发了三种不同类型的TMI。三种类型的TMI包括激光钻孔、垂直线键和铜柱互连。本文将介绍每种TMI的工艺流程和制造结果。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Through mold interconnects for fan-out wafer level package

Through mold interconnects (TMI) is a key enabler for fan-out wafer level packaging (FOWLP) for 3D integration. Three different types of TMI have been developed for both mold-first and RDL-first fabrication flow. The three types of TMI consist of laser drilled vias, vertical wire-bonds and Cu pillars interconnect. The process flow and fabrication results of each TMI will be presented in this paper.

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2016 IEEE 18th Electronics Packaging Technology Conference (EPTC)

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