利用全耗尽SOI器件的V/sub t/(V/sub b/)曲线准确测定主要参数

A. Toffoli, J. Pelloie, O. Faynot, C. Raynaud, B. Giffard, J. Hartmann
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引用次数: 0

摘要

本文介绍了一种简单而准确的方法来提取用于设计全耗尽SOI器件的主要工艺参数:埋藏氧化物厚度、硅膜厚度和掺杂水平。在200 ~ 500 /spl /的硅厚度范围内,对增强模式和积累模式器件进行了测量,并利用相应的解析模型从前置阈值电压随后门偏置的变化中提取了器件参数。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Accurate determination of the main parameters from V/sub t/(V/sub b/) curves of fully-depleted SOI devices
This paper describes a simple and accurate method to extract the main technological parameters: buried oxide thickness, silicon film thickness and doping level which are used to design fully-depleted SOI devices. Both enhancement-mode and accumulation-mode devices are measured for different silicon thicknesses from 200 to 500 /spl Aring/, the parameters are extracted from the variation of the front threshold voltage with the back gate bias using the corresponding analytical models.
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