离子注入In0.53Ga0.47As在1.55 μm超快饱和吸收装置

L. Fang, C. Bachelet, I. Sagnes, G. Beaudoin, J. Oudar
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引用次数: 0

摘要

退火后注入铁(Fe)离子可缩短in0.53 ga0.47 as基饱和吸收剂的载流子寿命,这是由于有效的Fe3+/Fe2+陷阱水平。研究了调制深度和不饱和损耗。此外,我们发现在InGaAs中引入Zn掺杂剂可以避免高激发载流子密度下fe相关阱能级的饱和。此外,通过比较As和fe注入的InGaAs样品,我们发现Fe2+/Fe3+在InGaAs中更有效地作为电子和空穴的陷阱中心,而电离的As仅是电子的陷阱中心。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Ion implanted In0.53Ga0.47As for ultrafast saturable absorber device at 1.55 μm
Iron (Fe) ion implantation with post-annealing was used to shorten the carrier lifetime of In0.53Ga0.47As-based saturable absorber due to an effective Fe3+/Fe2+ trap level. The modulation depth and the nonsaturable loss were investigated. Moreover, we found that the saturation of Fe-related trap level at high excited carrier density can be avoided by introducing Zn dopant in InGaAs. Furthermore, by comparing As and Fe-implanted InGaAs samples, we found that Fe2+/Fe3+ is more effective as a trap center for electrons and holes, while ionized As is a trap center only for electrons in InGaAs.
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