纳米多孔金作为多功能键合介质

2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2014-07-15 DOI:10.1109/LTB-3D.2014.6886185

Y.-C. Lin, W.-S. Wang, T. Gessner, M. Esashi

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引用次数: 0

摘要

采用二元合金沉积后再进行脱合金处理的方法制备了片上纳米孔金。利用这种新型纳米结构作为键合介质，在一个键合基质上将纳米多孔金与薄金膜结合，实现了低温键合、非均相键合、超薄膜键合和室温键合。

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Nanoporous gold as a versatile bonding intermediate

On-chip nanoporous gold fabrication was developed with binary alloy deposition subsequently a dealloying process. Using this novel nanostructure as the bonding intermediate, nanoporous gold on one bonding substrate was boned to a thin gold film, that realized low temperature bonding, heterogeneous bonding, ultra thin film bonding and room temperature bonding.

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2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

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