低压电机驱动的温度循环

J. Pippola, J. Kiilunen, L. Frisk
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引用次数: 1

摘要

电机驱动器广泛用于工业应用,其中许多应用对其中使用的电子设备提出了高可靠性要求。此外,工业应用中的环境条件可能变化很大,因此电机驱动器的可靠性研究是必不可少的。在本研究中,研究了低压电机驱动在两种不同温度循环曲线下的可靠性。研究结果表明,温度循环在测试过程中引发了一些可逆的设备故障,但在电力电子设备中常见的灾难性IGBT故障却很少见到。更详细的分析表明,器件故障的原因可能是器件的两个pcb之间的针孔连接器的焊点出现裂纹,或者是连接器接触材料的微动腐蚀。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Temperature cycling of low voltage motor drives
Motor drives are used in a wide range of industrial applications, many of which impose high reliability demands on the electronics used in them. Moreover, the environmental conditions in industrial applications may vary a lot and therefore reliability studies for the motor drives are essential. In this study the reliability of a low voltage motor drive was studied with two different temperature cycling profiles. The results of the study showed that temperature cycling triggered some reversible device faults during testing, but catastrophic IGBT failures, common for power electronics, were less seen. More detailed analysis suggests that the reason for the device faults may have been cracks in the solder joints of the pinheader connector between two PCBs of the device, or fretting corrosion on the connector contact materials.
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