用于快闪存储器的含氮再氧化隧道氧化物的开发与优化

Jung-Geun Jee, W. Kwon, Woong Lee, Jung-Hyun Park, Hyeong-Ki Kim, Ho-Min Son, Wonjong Chang, Jae-Jong Han, Y. Hyung, Hyeon-deok Lee
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引用次数: 12

摘要

三星电子正在开发的65nm节点NOR快闪存储器的可靠性,由于采用了新提出的再氧化隧道氧化物,得到了很大的提高。通过优化再氧化厚度/时间、退火过程中NO的分压、再氧化材料种类等工艺变量,循环后和循环后焙烧的Vth位移分别降至常规NO退火隧道氧化物的28%和42%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Development and Optimization of Re-Oxidized Tunnel Oxide with Nitrogen Incorporation for the Flash Memory Applications
The reliability properties of NOR flash memory with 65nm node being developed in Samsung electronics are greatly improved by using the newly proposed re-oxidized tunnel oxide. Especially, by optimizing the process variables such as the re-oxidation thickness/time, the partial pressure of NO during annealing, and the kinds of re-oxidizing materials, the Vth shifts post cycling and after post-cycling bake were decreased to the level of 28% and 42% of conventional NO annealed tunnel oxide, respectively.
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