老化弹性SRAM设计:端到端框架

X. Zuo, S. Gupta
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引用次数: 1

摘要

晶体管的性能因老化而下降。偏置温度不稳定性(BTI)是纳米级CMOS技术中最突出的老化机制。老化退化导致寿命失效,降低出货芯片的质量。我们开发了一个端到端SRAM设计框架,以最大限度地提高给定约束下的老化弹性。具体来说,我们分析了老化对SRAM外围电路的影响,包括地址解码器、预充电、写电路和感测放大器(SAs)。我们通过量化纠错码(ECC)的面积和延迟开销,以及估计带有纠错码的sram的寿命产率和DPPM来探讨纠错码(ECC)对抗老化的效率。我们还计算了采用ECC修复老化故障时的软错误恢复能力。在开销、寿命产率和DPPM方面比较基于单元大小和ECC的方法后,我们可以选择其中一种或这些方法的组合来确定在给定约束下抗老化的最佳设计。我们将我们的方法集成到现有的SRAM编译器CACTI[1]中,为设计人员提供端到端的能力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Aging-resilient SRAM design: an end-to-end framework
The performance of transistors degrades due to aging. Bias temperature instability (BTI) is the most prominent aging mechanism in nano-scale CMOS technologies. Aging degradation causes lifetime failures and lowers the quality of shipped chips. We have developed an end-to-end SRAM design framework to maximize the aging resilience under the given constraints. Specifically, we analyze the impact of aging in SRAM peripheral circuits, including address decoder, precharge, write circuit and sense amplifiers (SAs). We explore the efficiency of error-correcting codes (ECC) to combat aging by quantifying the area and delay overheads of ECC and estimating the lifetime yield and DPPM of SRAMs with ECC, respectively. We also calculate the soft error resilience when ECC is used to repair aging failures. After comparing approaches based on cell sizing and ECC in terms of overheads, lifetime yield and DPPM, we can choose either one or a combination of these approaches to identify the optimal design against aging under the given constraints. We integrate our methods into an existing SRAM compiler, CACTI [1], to provide the end-to-end capability to designers.
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