{"title":"开发一个解决方案来实现已知的好模具","authors":"L. Prokopchak","doi":"10.1109/TEST.1994.527931","DOIUrl":null,"url":null,"abstract":"A major problem curtailing the growth of the multichip module market is the IC manufacturer's inability to provide known-good-die. To address this, a cost-effective process to burn-in and test at the die level is in development.","PeriodicalId":309921,"journal":{"name":"Proceedings., International Test Conference","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":"{\"title\":\"Development of a solution for achieving known-good-die\",\"authors\":\"L. Prokopchak\",\"doi\":\"10.1109/TEST.1994.527931\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A major problem curtailing the growth of the multichip module market is the IC manufacturer's inability to provide known-good-die. To address this, a cost-effective process to burn-in and test at the die level is in development.\",\"PeriodicalId\":309921,\"journal\":{\"name\":\"Proceedings., International Test Conference\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1994-10-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"7\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings., International Test Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/TEST.1994.527931\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings., International Test Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TEST.1994.527931","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Development of a solution for achieving known-good-die
A major problem curtailing the growth of the multichip module market is the IC manufacturer's inability to provide known-good-die. To address this, a cost-effective process to burn-in and test at the die level is in development.
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