5G智能手机射频天线系统的性能和可靠性:温度场的影响

D. Rolando, Mehdi Abarham, G. Shankaran, Viral Gandhi
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引用次数: 0

摘要

过去十年见证了无线系统和智能设备的快速发展。在不久的将来,第五代(5G)无线标准的出现无疑将加速这一进步的步伐。5G无线提出了一个新的挑战,因为它的设备必须以适当的低成本扩展到大规模商业市场。因此,必须在性能和成本之间做出重大权衡-比许多前几代毫米波设备所需要的更多。在大量量产的5G设备中,模拟在帮助平衡这种权衡方面将变得越来越重要。本文介绍了一个仿真工作流程和案例研究,说明了综合多物理场方法设计无线系统的重要性,并展望了未来5G和毫米波设计的预期发展。首先确定天线在“理想”(即室温)条件下的电气性能。然后将电磁(EM)结果纳入热分析,以确定放大器和天线处于恒定“开”状态时稳态温度的空间变化。然后将热解反馈到EM仿真中,重新计算射频加热影响下天线的电性能。最后一步的关键是不仅要通过空间变化的热反馈来考虑3D模型的温度相关材料特性,还要考虑驱动电路原理图中组件的温度相关特性。这种综合的多物理场方法显示了天线发射系统性能下降的真正潜力。特别是考虑了阻抗匹配、辐射效率和调谐谐振频率等重要天线性能指标的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Performance and reliability of a 5G smartphone RF-antenna system: Influence of temperature field
The last decade has seen a rapid evolution of wireless systems and smart devices. The advent of fifth generation (5G) wireless standards in the near future will undoubtedly accelerate the pace of this advance. 5G wireless presents a new challenge in that its devices must be scalable to a mass commercial market at suitably low costs. Thus, a significant tradeoff must be made between performance and cost — more so than was necessary for many previous generations of mm-wave devices. Simulation will become increasingly more important in helping to balance this tradeoff in a multitude of mass-produced 5G devices. This paper presents a simulation workflow and case study that illustrates the importance of a comprehensive multi-physics approach to designing wireless systems, with a view towards expected developments in future 5G and mm-wave designs. The electrical performance of the antenna under “ideal” (i.e. room-temperature) conditions is determined first. The electromagnetic (EM) results are then incorporated in a thermal analysis to determine the spatial variation of steady-state temperature when the amplifier and antenna are in a constant “on” state. The thermal solution is then fed back to the EM simulation to re-compute the antenna's electrical performance under the influence of radio frequency (RF) heating. The key in this last step is to not only account for the temperature-dependent material properties of the 3D model via spatially-varying thermal feedback, but also to account for the temperature dependent properties of the components in the driving circuit schematic. This comprehensive multi-physics approach shows the true potential for performance degradation of the antenna transmitting system. In particular, the effect on the important antenna performance metrics of impedance match, radiative efficiency, and tuned resonant frequency are considered.
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