S. Harb, Emad S. Al-Momani, Bong-Seon Yu, Rajaa Alqudah
{"title":"高速LPDDR4内存测试应用的插座信号完整性评估","authors":"S. Harb, Emad S. Al-Momani, Bong-Seon Yu, Rajaa Alqudah","doi":"10.1109/EPTC47984.2019.9076717","DOIUrl":null,"url":null,"abstract":"As the data rate of Low Power Double Data Rate 4 (LPDDR4) memory is reaching higher speeds, it is becoming more crucial to evaluate and assess the electrical performance of the viable socket technologies in the market. This paper presents a signal integrity (SI) evaluation for gripper-type pin technology, one of the commercially available socket technologies which potentially can be enabled for high speed LPDDR4 memory test applications with a data transmission rate of up to 2.4 Gb/s. We performed three-dimensional numerical simulations with a commercially available 3D FEM (finite element method)-based full-wave software package (Ansoft HFSS). We evaluated No-Socket vs. Single-Sided gripper socket pins and compared their signal transmission characteristics. Simulation results showed that the worst case margin degradation for the single-sided gripper socket could be improved by reducing the Z-axis height of the socket pin to minimize crosstalk and achieve better performance at higher GHz frequencies.","PeriodicalId":244618,"journal":{"name":"2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)","volume":"29 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Socket Signal Integrity Assessment for High Speed LPDDR4 Memory Test Applications\",\"authors\":\"S. Harb, Emad S. Al-Momani, Bong-Seon Yu, Rajaa Alqudah\",\"doi\":\"10.1109/EPTC47984.2019.9076717\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"As the data rate of Low Power Double Data Rate 4 (LPDDR4) memory is reaching higher speeds, it is becoming more crucial to evaluate and assess the electrical performance of the viable socket technologies in the market. This paper presents a signal integrity (SI) evaluation for gripper-type pin technology, one of the commercially available socket technologies which potentially can be enabled for high speed LPDDR4 memory test applications with a data transmission rate of up to 2.4 Gb/s. We performed three-dimensional numerical simulations with a commercially available 3D FEM (finite element method)-based full-wave software package (Ansoft HFSS). We evaluated No-Socket vs. Single-Sided gripper socket pins and compared their signal transmission characteristics. Simulation results showed that the worst case margin degradation for the single-sided gripper socket could be improved by reducing the Z-axis height of the socket pin to minimize crosstalk and achieve better performance at higher GHz frequencies.\",\"PeriodicalId\":244618,\"journal\":{\"name\":\"2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)\",\"volume\":\"29 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPTC47984.2019.9076717\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC47984.2019.9076717","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Socket Signal Integrity Assessment for High Speed LPDDR4 Memory Test Applications
As the data rate of Low Power Double Data Rate 4 (LPDDR4) memory is reaching higher speeds, it is becoming more crucial to evaluate and assess the electrical performance of the viable socket technologies in the market. This paper presents a signal integrity (SI) evaluation for gripper-type pin technology, one of the commercially available socket technologies which potentially can be enabled for high speed LPDDR4 memory test applications with a data transmission rate of up to 2.4 Gb/s. We performed three-dimensional numerical simulations with a commercially available 3D FEM (finite element method)-based full-wave software package (Ansoft HFSS). We evaluated No-Socket vs. Single-Sided gripper socket pins and compared their signal transmission characteristics. Simulation results showed that the worst case margin degradation for the single-sided gripper socket could be improved by reducing the Z-axis height of the socket pin to minimize crosstalk and achieve better performance at higher GHz frequencies.