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低轮廓tsop方法MSL 1无分层

2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) Pub Date : 2010-11-01 DOI:10.1109/IEMT.2010.5746674
C. Lum
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引用次数: 1

摘要

一个低姿态的TSOP包有模具桨和引线后分层后预控MSL 1回流260°C的历史。
本文章由计算机程序翻译，如有差异，请以英文原文为准。
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Low profile tsop approach for MSL 1 delamination free
A low profile TSOP package has the history of die paddle and lead post delamination after pre-con MSL 1 reflow 260°C.
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来源期刊
2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT)
2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT)
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