用于晶圆级封装的低应力介电层，可减少晶圆翘曲并提高板级温度循环可靠性

2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) Pub Date : 2016-11-01 DOI:10.1109/EPTC.2016.7861466

J. Huneke, SweeTeck Tay

{"title":"用于晶圆级封装的低应力介电层，可减少晶圆翘曲并提高板级温度循环可靠性","authors":"J. Huneke, SweeTeck Tay","doi":"10.1109/EPTC.2016.7861466","DOIUrl":null,"url":null,"abstract":"This paper presents a negative-tone photoimageable spinon dielectric material that is based on a unique molecule for wafer level packaging application. The molecule is an extended polyimide having photoactive maleimide end groups. It is an ideal alternative to conventional dielectric materials for solving both the wafer warpage and temperature cycle RDL crack issues.","PeriodicalId":136525,"journal":{"name":"2016 IEEE 18th Electronics Packaging Technology Conference (EPTC)","volume":"219 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Low stress dielectric layers for wafer level packages to reduce wafer warpage and improve board-level temperature-cycle reliability\",\"authors\":\"J. Huneke, SweeTeck Tay\",\"doi\":\"10.1109/EPTC.2016.7861466\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents a negative-tone photoimageable spinon dielectric material that is based on a unique molecule for wafer level packaging application. The molecule is an extended polyimide having photoactive maleimide end groups. It is an ideal alternative to conventional dielectric materials for solving both the wafer warpage and temperature cycle RDL crack issues.\",\"PeriodicalId\":136525,\"journal\":{\"name\":\"2016 IEEE 18th Electronics Packaging Technology Conference (EPTC)\",\"volume\":\"219 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 IEEE 18th Electronics Packaging Technology Conference (EPTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPTC.2016.7861466\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE 18th Electronics Packaging Technology Conference (EPTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC.2016.7861466","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 1

摘要

本文提出了一种基于独特分子的负色调光致自旋介电材料，用于晶圆级封装。该分子是具有光活性马来酰亚胺端基的扩展聚酰亚胺。它是传统介质材料的理想替代品，可以解决晶圆翘曲和温度循环RDL裂纹问题。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Low stress dielectric layers for wafer level packages to reduce wafer warpage and improve board-level temperature-cycle reliability

This paper presents a negative-tone photoimageable spinon dielectric material that is based on a unique molecule for wafer level packaging application. The molecule is an extended polyimide having photoactive maleimide end groups. It is an ideal alternative to conventional dielectric materials for solving both the wafer warpage and temperature cycle RDL crack issues.

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2016 IEEE 18th Electronics Packaging Technology Conference (EPTC)

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