针对先进技术节点软误差的触发器设计对比分析

2011 IEEE International Conference on IC Design & Technology Pub Date : 2011-05-02 DOI:10.1109/ICICDT.2011.5783239

B. Bhuva, K. Lilja, J. Holts, S. Wen, R. Wong, S. Jagannathan, T. D. Loveless, M. Mccurdy, Z. Diggins

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引用次数: 6

摘要

对于先进的制造技术节点，正在观察到新的单事件相关故障。本文详细介绍了使用3D TCAD模拟来模拟这些失效机制并开发触发器设计的缓解技术的努力。仿真和实验结果显示了这种方法对未来CMOS技术的有效性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Comparative analysis of flip-flop designs for soft errors at advanced technology nodes

For advanced fabrication technology nodes, novel single-event related failures are being observed. This paper details efforts to use 3D TCAD simulations to model these failure mechanisms and develop mitigation techniques for flip-flop designs. Simulation, as well as experimental, results are used to show validity of such an approach for future CMOS technologies.

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来源期刊

2011 IEEE International Conference on IC Design & Technology

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