系统级封装(SiP)实现平台的电气和热分析

Fourth International Symposium on Quality Electronic Design, 2003. Proceedings. Pub Date : 2003-03-24 DOI:10.1109/ISQED.2003.1194736

Michael X. Wang, Katsuharu Suzuki, W. Dai

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引用次数: 3

摘要

本文介绍了一种基于芯片层压芯片(CLC)技术的系统级封装(SiP)存储/逻辑实现平台的电学和热学性能分析。对CLC模块内部IO接口进行了建模，并与SC实现进行了比较。热分析，包括与堆栈芯片和系统单芯片(SoC)的比较。研究表明，与传统SiP技术相比，CLC技术具有显著的性能优势，对未来的系统级集成具有重要影响。

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Electrical and thermal analysis for system-in-a package (SiP) implementation platform

This paper presents an electrical and thermal performance analysis of system-in-a-package (SiP) memory/logic implementation platform based on chip-laminate-chip (CLC) technology. Internal IO interface inside CLC module has been modeled and compared with stack-chip (SC) implementation. Thermal analysis, including comparison against stack-chip and system-on- a-chip (SoC) is also presented. It is demonstrated that CLC technology provides significant performance advantage over conventional SiP technologies and has great impact on future system-level integration.

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Fourth International Symposium on Quality Electronic Design, 2003. Proceedings.

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