Wei-chung Chen, C. Lee, Lu-Fu Lin, Yen-Fu Liu, H. Cheng, T.-J Hsu, Kun-Ting Tsai, Ming-Hung Chen, Tang-Yuan Chen, P. Yang, S. Uegaki, C. Hung
{"title":"嵌入式封装装置中铜合金引线框架层压预处理的新型铜表面制备工艺","authors":"Wei-chung Chen, C. Lee, Lu-Fu Lin, Yen-Fu Liu, H. Cheng, T.-J Hsu, Kun-Ting Tsai, Ming-Hung Chen, Tang-Yuan Chen, P. Yang, S. Uegaki, C. Hung","doi":"10.1109/ICEP.2016.7486883","DOIUrl":null,"url":null,"abstract":"In this paper, the interface adhesion and reliability between copper lead frame(C-19210) and resin prepreg material of different copper lead frame lamination pretreatment processes (CZ and brown oxide) was studied. Surface morphology, roughness, peel strength and moisture sensitivity level, MSL3, reliability tests were performed in order to investigate the performance between these pretreatment procedures. CZ (HCl/formic acid system) process for copper etching is commonly used for lamination pretreatment, but it is not suitable to create uniformity coarse surface on copper alloy material. Compare to CZ, brown oxide gives better uniformity morphology, higher Ra/s-ratio and stronger peel strength. Reliability test including precondition + MSL3 (failure rate: BO CZ=14:100) and solder dipping (260, 270, 288 °C × 10 times) were performed to evaluate the bond strength.","PeriodicalId":343912,"journal":{"name":"2016 International Conference on Electronics Packaging (ICEP)","volume":"50 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-04-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Novel copper surface preparation processes for copper alloy lead frame lamination pretreatment in embedded packaging device\",\"authors\":\"Wei-chung Chen, C. Lee, Lu-Fu Lin, Yen-Fu Liu, H. Cheng, T.-J Hsu, Kun-Ting Tsai, Ming-Hung Chen, Tang-Yuan Chen, P. Yang, S. Uegaki, C. Hung\",\"doi\":\"10.1109/ICEP.2016.7486883\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, the interface adhesion and reliability between copper lead frame(C-19210) and resin prepreg material of different copper lead frame lamination pretreatment processes (CZ and brown oxide) was studied. Surface morphology, roughness, peel strength and moisture sensitivity level, MSL3, reliability tests were performed in order to investigate the performance between these pretreatment procedures. CZ (HCl/formic acid system) process for copper etching is commonly used for lamination pretreatment, but it is not suitable to create uniformity coarse surface on copper alloy material. Compare to CZ, brown oxide gives better uniformity morphology, higher Ra/s-ratio and stronger peel strength. Reliability test including precondition + MSL3 (failure rate: BO CZ=14:100) and solder dipping (260, 270, 288 °C × 10 times) were performed to evaluate the bond strength.\",\"PeriodicalId\":343912,\"journal\":{\"name\":\"2016 International Conference on Electronics Packaging (ICEP)\",\"volume\":\"50 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-04-20\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 International Conference on Electronics Packaging (ICEP)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEP.2016.7486883\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 International Conference on Electronics Packaging (ICEP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEP.2016.7486883","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Novel copper surface preparation processes for copper alloy lead frame lamination pretreatment in embedded packaging device
In this paper, the interface adhesion and reliability between copper lead frame(C-19210) and resin prepreg material of different copper lead frame lamination pretreatment processes (CZ and brown oxide) was studied. Surface morphology, roughness, peel strength and moisture sensitivity level, MSL3, reliability tests were performed in order to investigate the performance between these pretreatment procedures. CZ (HCl/formic acid system) process for copper etching is commonly used for lamination pretreatment, but it is not suitable to create uniformity coarse surface on copper alloy material. Compare to CZ, brown oxide gives better uniformity morphology, higher Ra/s-ratio and stronger peel strength. Reliability test including precondition + MSL3 (failure rate: BO CZ=14:100) and solder dipping (260, 270, 288 °C × 10 times) were performed to evaluate the bond strength.
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