Ho-Eun Bae, Kwang-Seong Choi, Hyun-Cheol Bae, Y. Eom, D. Bae
{"title":"细间距，小批量SoP(焊盘焊)工艺","authors":"Ho-Eun Bae, Kwang-Seong Choi, Hyun-Cheol Bae, Y. Eom, D. Bae","doi":"10.1109/EPTC.2012.6507177","DOIUrl":null,"url":null,"abstract":"Low-volume, low-cost and lead-free Solder-on-Pad (SoP) process using solder bump maker (SBM) is proposed for the fine-pitch flip-chip bonding process. The SBM is composed of a lead-free solder powder and a resin. The resin in the SBM consists of a polymer matrix, a deoxidizing agent and additives. The deoxidizing agent and additives remove the oxide layer on the surface of the solder powder. The bumping process features no-mask process so that a fine pitch bump array can be easily achievable. It mainly consists of two thermal steps; one is for the aggregation of the solder powder on the metal pads on a substrate and the other for the reflow process to make the round solder bump array. The thermo-rheological behavior of the SBM was characterized using a differential scanning calorimetry (DSC) and a dynamic mechanical analyzer (DMA). With this material and process, the solder bump array was successfully formed with pitch of 130μm.","PeriodicalId":431312,"journal":{"name":"2012 IEEE 14th Electronics Packaging Technology Conference (EPTC)","volume":"141 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Fine-pitch, low-volume SoP(Solder-on-Pad) process\",\"authors\":\"Ho-Eun Bae, Kwang-Seong Choi, Hyun-Cheol Bae, Y. Eom, D. Bae\",\"doi\":\"10.1109/EPTC.2012.6507177\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Low-volume, low-cost and lead-free Solder-on-Pad (SoP) process using solder bump maker (SBM) is proposed for the fine-pitch flip-chip bonding process. The SBM is composed of a lead-free solder powder and a resin. The resin in the SBM consists of a polymer matrix, a deoxidizing agent and additives. The deoxidizing agent and additives remove the oxide layer on the surface of the solder powder. The bumping process features no-mask process so that a fine pitch bump array can be easily achievable. It mainly consists of two thermal steps; one is for the aggregation of the solder powder on the metal pads on a substrate and the other for the reflow process to make the round solder bump array. The thermo-rheological behavior of the SBM was characterized using a differential scanning calorimetry (DSC) and a dynamic mechanical analyzer (DMA). With this material and process, the solder bump array was successfully formed with pitch of 130μm.\",\"PeriodicalId\":431312,\"journal\":{\"name\":\"2012 IEEE 14th Electronics Packaging Technology Conference (EPTC)\",\"volume\":\"141 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2012 IEEE 14th Electronics Packaging Technology Conference (EPTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPTC.2012.6507177\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 IEEE 14th Electronics Packaging Technology Conference (EPTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC.2012.6507177","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Low-volume, low-cost and lead-free Solder-on-Pad (SoP) process using solder bump maker (SBM) is proposed for the fine-pitch flip-chip bonding process. The SBM is composed of a lead-free solder powder and a resin. The resin in the SBM consists of a polymer matrix, a deoxidizing agent and additives. The deoxidizing agent and additives remove the oxide layer on the surface of the solder powder. The bumping process features no-mask process so that a fine pitch bump array can be easily achievable. It mainly consists of two thermal steps; one is for the aggregation of the solder powder on the metal pads on a substrate and the other for the reflow process to make the round solder bump array. The thermo-rheological behavior of the SBM was characterized using a differential scanning calorimetry (DSC) and a dynamic mechanical analyzer (DMA). With this material and process, the solder bump array was successfully formed with pitch of 130μm.
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