汽车客户退货倾斜模具分辨率

2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Pub Date : 2016-07-18 DOI:10.1109/IPFA.2016.7564257

Andrew C. Sabate, A. Hamid, Dineshwaran Naidu Gunalan

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引用次数: 0

摘要

通常的故障分析步骤可能无法保证所有故障机制类型的根本原因。由于某种破坏机制，脱囊或后磨后恢复破坏是不可避免的。本文旨在探讨解决因包装重新设计而导致的倾斜模具失效机理问题的分析方法，以消除汽车客户进一步的质量问题。

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Automotive customer returns tilted die resolution

Usual Failure Analysis steps may not guarantee the root cause for all failure mechanism type. It is inevitable that the failure may recover after decapsulation or backside grinding for some failure mechanism. The paper aims to discuss analysis approach used in resolving tilted die failure mechanism issue resulting to package re-design eliminating further quality issue with automotive customer.

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2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

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