用于电力电子封装的Al/SiC

Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces Pub Date : 1997-03-09 DOI:10.1109/ISAPM.1997.581284

M. K. Premkumar

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引用次数: 3

摘要

Al/SiC复合材料具有非常接近陶瓷的CTE以及高导热性。此外，这些复合材料的弹性模量是Cu的2/spl倍，密度比Cu小66%。这些特性使得封装设计明显优于传统的铜基板设计。本报告讨论了Al/SiC在电力电子封装中的独特性能。介绍并讨论了铝/碳化硅产品的热循环及其它可靠性试验结果。

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Al/SiC for power electronics packaging

Al/SiC composites have a CTE that very closely matches ceramics along with a high thermal conductivity. In addition, these composites also have an elastic modulus that is 2/spl times/ that of Cu and a density that is 66% less than that of Cu. These properties allow for a package design that is significantly superior to the traditional Cu baseplate design. This presentation discusses the unique properties of Al/SiC as it applies to power electronics packaging. The results of thermal cycling and other reliability testing of Al/SiC products are presented and discussed.

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Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces

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