CO - UBM与Sn倒装焊点间形成的CoSn/sub - 2/金属间层的纳米硬度研究

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) Pub Date : 2004-12-08 DOI:10.1109/EPTC.2004.1396630

P. Ratchev, R. Labie, E. Beyne

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引用次数: 15

摘要

在无铅焊点中使用Co作为UBM的可能性与在焊料-UBM界面形成的金属间层的可靠性有关。相互扩散反应生成了一层CoSn/sub - 2/金属间化合物，并通过纳米压痕对其进行了测试。测得的纳米硬度为2Gpa，低于文献报道的Ag/sub 3/Sn、Cu/sub 3/Sn或Cu/sub 6/Sn/sub 5/纳米硬度。这使得这种金属间化合物发生脆性行为的可能性非常低，这一点通过SEM检查得到了证实。测量到的CoSn/sub - 2/金属间层的硬度较低，而Co-CoSn/sub - 2/-Sn层的硬度逐渐变化，表明该界面在焊点寿命期间是非常稳定可靠的。

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Nanohardness study of CoSn/sub 2/ intermetallic layers formed between CO UBM and Sn flip-chip solder joints

The possibility to use Co as UBM for Pb-free solder joints is related to the reliability of the formed intermetallic layers at the solder-UBM interface. The interdiffusion reaction results in a layer of CoSn/sub 2/ intermetallic, which was tested by means of nanoindentation. A nanohardness of 2Gpa was measured, which is lower then the one of Ag/sub 3/Sn, Cu/sub 3/Sn or Cu/sub 6/Sn/sub 5/, reported in the literature. This makes the chances of brittle behaviour of this intermetallic very low, which is confirmed by SEM examinations. The measured low hardness of the CoSn/sub 2/ intermetallic layer and the gradual change of the hardness in the stack Co-CoSn/sub 2/-Sn suggest that this interface will be very stable and reliable during the lifetime of the solder joint.

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Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)

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