CSST:防止由不可信的代工和组装分发未经许可和被拒绝的ic

Md. Tauhidur Rahman, Domenic Forte, Quihang Shi, Gustavo K. Contreras, M. Tehranipoor
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引用次数: 57

摘要

半导体设计和制造行业的全球化(也被称为横向商业模式)导致了许多与不可信的代工厂和组装相关的问题,包括IC生产过剩、克隆以及不适当或测试不足的芯片的运输。除了知识产权(IP)所有者的利润损失外,此类芯片进入供应链可能会对关键应用产生灾难性后果。我们提出了一种新的安全分离测试(SST)方案,称为康涅狄格SST (CSST),其中IP所有者完全控制测试。在CSST中,每个芯片及其扫描链在测试过程中被锁定,只有IP所有者才能解释锁定的测试结果并解锁通过的芯片。新的SST可以防止过度生产,缺陷和克隆芯片到达供应链。与原始版本的SST相比,所提出的方法大大简化了铸造厂/组装厂和IP所有者之间所需的通信。结果表明,我们的新技术比原来的更安全,并且具有更低的通信开销。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
CSST: Preventing distribution of unlicensed and rejected ICs by untrusted foundry and assembly
The globalization of the semiconductor design and fabrication industry (also known as the horizontal business model) has led to many well-documented issues associated with untrusted foundries and assemblies, including IC overproduction, cloning, and the shipping of improperly or insufficiently tested chips. Besides the loss in profits to Intellectual Property (IP) owners, such chips entering the supply chain can have catastrophic consequences for critical applications. We propose a new Secure Split-Test (SST) scheme called the Connecticut SST (CSST) in which the IP owner takes full control over testing. In CSST, each chip and its scan chains are locked during testing, and only the IP owner can interpret the locked test results and unlock passing chips. The new SST can prevent overproduced, defective, and cloned chips from reaching the supply chain. The proposed method considerably simplifies the communication required between the foundry/assembly and the IP owner compared to the original version of the SST. The results demonstrate that our new technique is more secure than the original and has lower communication overheads.
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