金凤花失败:不要太软,也不要太硬

S. Nassif, V. Kleeberger, Ulf Schlichtmann
{"title":"金凤花失败:不要太软,也不要太硬","authors":"S. Nassif, V. Kleeberger, Ulf Schlichtmann","doi":"10.1109/ETS.2012.6232999","DOIUrl":null,"url":null,"abstract":"It is well known that circuits fail when one or more of the constituent components fails, due -for example- to phenomena such as electromigration in wires. Such hard failures, typically due to topological changes in circuit connectivity, are treated distinctly from soft failures which could be due to components drifting out of spec over time. However, in certain types of circuits, such as memory, the distinction between soft and hard failures is not clearly defined. The primary cause of the blurring between these two phenomena is manufacturing variability, which can make a topologically correct circuit behave as if it had a short or an open. This paper will show the linkage between these two failure types, and show how increasing variability in future technologies will likely exacerbate this problem further.","PeriodicalId":341663,"journal":{"name":"2012 IEEE International Reliability Physics Symposium (IRPS)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-04-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"19","resultStr":"{\"title\":\"Goldilocks failures: Not too soft, not too hard\",\"authors\":\"S. Nassif, V. Kleeberger, Ulf Schlichtmann\",\"doi\":\"10.1109/ETS.2012.6232999\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"It is well known that circuits fail when one or more of the constituent components fails, due -for example- to phenomena such as electromigration in wires. Such hard failures, typically due to topological changes in circuit connectivity, are treated distinctly from soft failures which could be due to components drifting out of spec over time. However, in certain types of circuits, such as memory, the distinction between soft and hard failures is not clearly defined. The primary cause of the blurring between these two phenomena is manufacturing variability, which can make a topologically correct circuit behave as if it had a short or an open. This paper will show the linkage between these two failure types, and show how increasing variability in future technologies will likely exacerbate this problem further.\",\"PeriodicalId\":341663,\"journal\":{\"name\":\"2012 IEEE International Reliability Physics Symposium (IRPS)\",\"volume\":\"9 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-04-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"19\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2012 IEEE International Reliability Physics Symposium (IRPS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ETS.2012.6232999\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 IEEE International Reliability Physics Symposium (IRPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ETS.2012.6232999","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 19

摘要

众所周知,当一个或多个组成元件失效时,电路会失效,例如,由于电线中的电迁移等现象。这种硬故障通常是由于电路连接的拓扑变化造成的,与软故障的处理方式截然不同,软故障可能是由于组件随着时间的推移偏离了规格。然而,在某些类型的电路中,例如存储器,软故障和硬故障之间的区别并没有明确定义。这两种现象之间模糊的主要原因是制造变异性,它可以使拓扑正确的电路表现得好像它有短路或开路。本文将展示这两种故障类型之间的联系,并展示未来技术中日益增加的可变性如何可能进一步加剧这一问题。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Goldilocks failures: Not too soft, not too hard
It is well known that circuits fail when one or more of the constituent components fails, due -for example- to phenomena such as electromigration in wires. Such hard failures, typically due to topological changes in circuit connectivity, are treated distinctly from soft failures which could be due to components drifting out of spec over time. However, in certain types of circuits, such as memory, the distinction between soft and hard failures is not clearly defined. The primary cause of the blurring between these two phenomena is manufacturing variability, which can make a topologically correct circuit behave as if it had a short or an open. This paper will show the linkage between these two failure types, and show how increasing variability in future technologies will likely exacerbate this problem further.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信