低成本多芯片模块的可测试性和信号完整性

1996 Proceedings. Eighth Annual IEEE International Conference on Innovative Systems in Silicon Pub Date : 1996-10-09 DOI:10.1109/ICISS.1996.552426

A. Omer, A. Flint

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引用次数: 1

摘要

介绍了低成本多芯片模块的设计过程。为了提高可测试性，经常对设计进行修改。然而，其中一些修改会降低信号的完整性。为了做出合理的设计权衡，提出了需要考虑的重要方面。

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Testability and signal integrity in a low cost multichip module

The design process for low-cost multichip modules is presented. Modifications to the design are often made in order to increase testability. Some of these modifications can degrade signal integrity, however. The important aspects to consider in order to make rational design tradeoffs are presented.

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1996 Proceedings. Eighth Annual IEEE International Conference on Innovative Systems in Silicon

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