{"title":"金焊线中控制环形的因素","authors":"Y. Ohno, Y. Ohzeki, T. Aso, O. Kitamura","doi":"10.1109/ECTC.1992.204313","DOIUrl":null,"url":null,"abstract":"It is found by studying the factors governing the loop profile in Au bonding wires that the thermal history in forming the ball caused the observed V-shaped hardness distribution in the heat affected zone. It is proved by combining calculation and simulation that the minimum hardness portion is a dominant factor governing the loop height. As recent LSI packaging is becoming thinner and thinner, a low profile wire is required for the bonding wire, which can be developed by utilizing this approach.<<ETX>>","PeriodicalId":125270,"journal":{"name":"1992 Proceedings 42nd Electronic Components & Technology Conference","volume":"21 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1992-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"18","resultStr":"{\"title\":\"Factors governing the loop profile in Au bonding wire\",\"authors\":\"Y. Ohno, Y. Ohzeki, T. Aso, O. Kitamura\",\"doi\":\"10.1109/ECTC.1992.204313\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"It is found by studying the factors governing the loop profile in Au bonding wires that the thermal history in forming the ball caused the observed V-shaped hardness distribution in the heat affected zone. It is proved by combining calculation and simulation that the minimum hardness portion is a dominant factor governing the loop height. As recent LSI packaging is becoming thinner and thinner, a low profile wire is required for the bonding wire, which can be developed by utilizing this approach.<<ETX>>\",\"PeriodicalId\":125270,\"journal\":{\"name\":\"1992 Proceedings 42nd Electronic Components & Technology Conference\",\"volume\":\"21 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1992-05-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"18\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1992 Proceedings 42nd Electronic Components & Technology Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.1992.204313\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1992 Proceedings 42nd Electronic Components & Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1992.204313","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Factors governing the loop profile in Au bonding wire
It is found by studying the factors governing the loop profile in Au bonding wires that the thermal history in forming the ball caused the observed V-shaped hardness distribution in the heat affected zone. It is proved by combining calculation and simulation that the minimum hardness portion is a dominant factor governing the loop height. As recent LSI packaging is becoming thinner and thinner, a low profile wire is required for the bonding wire, which can be developed by utilizing this approach.<>
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