使用牺牲层的复制工艺制备具有原子光滑表面的电镀Au图案的室温键合

2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2014-08-28 DOI:10.1109/LTB-3D.2014.6886164

Y. Kurashima, A. Maeda, H. Takagi

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引用次数: 0

摘要

我们演示了一个表面形状的复制过程，从原子光滑的主衬底到电镀的Au图案，通过使用薄牺牲层的提升工艺。该工艺可制备出原子光滑的金表面，表面均方根粗糙度为0.8 nm。我们还测试了它在室温空气中金-金键合的适用性。获得了约250 MPa的高结合强度。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Room temperature bonding of electroplated Au patterns with atomically smooth surface prepared by a replication process using a sacrificial layer

We demonstrate a replication process of a surface shape from an atomically smooth master substrate onto electroplated Au patterns by a lift-off process using a thin sacrificial layer. An atomically smooth Au surface with a root mean square surface roughness of 0.8 nm could be created by the process. We also examined its applicability to room-temperature Au-Au bonding in air. A high bonding strength of about 250 MPa was obtained.

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2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

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