高压隔离器焊丝粘接引起局部放电的实例研究

2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Pub Date : 2018-07-01 DOI:10.1109/IPFA.2018.8452558

Manita Duangsang, Nophakam Thankham

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引用次数: 0

摘要

大多数在高压隔离试验中失败的器件在解封装后出现横向介质击穿。失效分析结果解释了集成电路组装过程中的不规律性，导致局部放电导致介质击穿，称为树形。结合根本原因验证和装配过程的线接参数仿真，指出参数修改不当导致电气树形。

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Case Study on Wire Bonding - Related Partial Discharge on High-Voltage Isolators

Most devices which failed during High Voltage Isolation Testing seen a lateral dielectric breakdown after decapsulation. Failure analysis results explained the irregularity in IC assembly process causing the partial discharge that leads to dielectric breakdown, called treeing. This explanation together with root cause verification and wire bond parameter simulation from assembly process pointed out that the improper parameter modification resulted to electrical treeing.

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2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

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