下一代微电子器件的热管理概述

Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI Pub Date : 2003-04-22 DOI:10.1109/ASMC.2003.1194502

S. S. Tonapi, R. Fillion, F.J. Schattenmann, H.S. Cole, J. D. Evans, B. Sammakia

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引用次数: 33

摘要

对更小、更快和更轻的产品的需求对微电子的热管理提出了相当大的要求。本文概述了消费和航空航天电子产品的热管理问题。介绍了复杂高端系统的典型解决方案。热界面材料的作用是高性能消费电子产品热管理的关键，本文也对此进行了讨论。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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An overview of thermal management for next generation microelectronic devices

The need for smaller, faster and lighter products has put considerable demands on the thermal management of microelectronics. This paper outlines the issues in thermal management of consumer and aerospace electronics. Some typical solutions for complex high-end systems are presented. The role of the thermal interface material is a key to the thermal management of high performance consumer electronics and is also addressed in this paper.

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Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI

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