堆叠封装的可靠性改变了快闪记忆体应用的晶片堆叠架构

Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium Pub Date : 2006-03-14 DOI:10.1109/STHERM.2006.1625232

M. Hossain, Yongje Lee, R. Akhter, D. Agonafer, S. Pekin, T. Dishongh

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引用次数: 8

摘要

对半导体闪存产品中常用的各种芯片堆叠结构的热分析表明，热问题不是堆叠芯片结构的主导因素，并导致研究热-机械和机械组合应力的影响。由于存在多个具有不同cte的模具和其他材料，因此需要研究热机械载荷及其对可靠性的影响，以优化封装设计和模具配置

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Reliability of stack packaging varying the die stacking architectures for flash memory applications

Thermal analysis on various die stacking architectures, which are commonly employed in semiconductor flash products shows that thermal issues are not dominant for stack die configuration and leads to study the effect of combined thermo-mechanical and mechanical stresses. As there are existence of multiple die and other material with different CTEs, thermo-mechanical loading and its effect on reliability needs to be studied for optimum package design and die configuration

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Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium

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