基于深度学习的SEM图像去噪(会议报告)

D. Cerbu, S. Halder, P. Leray
{"title":"基于深度学习的SEM图像去噪(会议报告)","authors":"D. Cerbu, S. Halder, P. Leray","doi":"10.1117/12.2515182","DOIUrl":null,"url":null,"abstract":"Deep-learning-based SEM image denoiser\n\nDorin Cerbu1, Sandip Halder1, Philippe Leray1\n\n1IMEC, Kapeldreef 75, B-3001 Leuven, Belgium\n\n\nWe report the development of a new method to denoise SEM images with the help of artificial neural networks. Upon using a preprocessing and training scheme tailored for SEM images of structures, most often encountered in semiconductor manufacturing, we can efficiently denoise images affected with varying degrees of noise severity and origin. In the figure below, we show an example of how we can use this filter efficiently to treat noisy images and improve the image quality. This can help in acquisition of more stable and better metrology data. \n\nFig1(a) original image (b) Image which has been denoised using deep-learning based algorithms\n\nThis development is of utmost importance for the case of post-litho processing step where resist nanostructures when SEM inspected are usually impacted by the electron beam and shrink, hence skewing critical dimension measurements. This is especially true as we push towards sub N-10 nm nodes. Application of our deep-learning processing scheme allows efficient noise reduction on SEM inspection images and helps us discern minor details previously shadowed by noise. This is extremely important as we move towards using EUV in high volume manufacturing. Small details can be crucial to understand the root-cause of stochastic and process defects. In previous work, we have already shown different approaches to understand stochastic defects [1-2]. The goal of this work is to enhance the image quality as much as possible to gain further fundamental understanding on nano-defects. \n\n[1] S. Halder et. al., ‘Using machine learning techniques to understand EUV stochastics, SPIE Photomask Technology + Extreme Ultraviolet Lithography, 2018\n[2] K. Sah et.al., ‘EUV stochastic defect monitoring with advanced Broadband optical wafer inspection and e-Beam review systems’, SPIE Photomask Technology + Extreme Ultraviolet Lithography, 2018","PeriodicalId":331248,"journal":{"name":"Metrology, Inspection, and Process Control for Microlithography XXXIII","volume":"155 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-03-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"Deep-learning-based SEM image denoiser (Conference Presentation)\",\"authors\":\"D. Cerbu, S. Halder, P. Leray\",\"doi\":\"10.1117/12.2515182\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Deep-learning-based SEM image denoiser\\n\\nDorin Cerbu1, Sandip Halder1, Philippe Leray1\\n\\n1IMEC, Kapeldreef 75, B-3001 Leuven, Belgium\\n\\n\\nWe report the development of a new method to denoise SEM images with the help of artificial neural networks. Upon using a preprocessing and training scheme tailored for SEM images of structures, most often encountered in semiconductor manufacturing, we can efficiently denoise images affected with varying degrees of noise severity and origin. In the figure below, we show an example of how we can use this filter efficiently to treat noisy images and improve the image quality. This can help in acquisition of more stable and better metrology data. \\n\\nFig1(a) original image (b) Image which has been denoised using deep-learning based algorithms\\n\\nThis development is of utmost importance for the case of post-litho processing step where resist nanostructures when SEM inspected are usually impacted by the electron beam and shrink, hence skewing critical dimension measurements. This is especially true as we push towards sub N-10 nm nodes. Application of our deep-learning processing scheme allows efficient noise reduction on SEM inspection images and helps us discern minor details previously shadowed by noise. This is extremely important as we move towards using EUV in high volume manufacturing. Small details can be crucial to understand the root-cause of stochastic and process defects. In previous work, we have already shown different approaches to understand stochastic defects [1-2]. The goal of this work is to enhance the image quality as much as possible to gain further fundamental understanding on nano-defects. \\n\\n[1] S. Halder et. al., ‘Using machine learning techniques to understand EUV stochastics, SPIE Photomask Technology + Extreme Ultraviolet Lithography, 2018\\n[2] K. Sah et.al., ‘EUV stochastic defect monitoring with advanced Broadband optical wafer inspection and e-Beam review systems’, SPIE Photomask Technology + Extreme Ultraviolet Lithography, 2018\",\"PeriodicalId\":331248,\"journal\":{\"name\":\"Metrology, Inspection, and Process Control for Microlithography XXXIII\",\"volume\":\"155 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-03-26\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Metrology, Inspection, and Process Control for Microlithography XXXIII\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1117/12.2515182\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Metrology, Inspection, and Process Control for Microlithography XXXIII","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1117/12.2515182","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5

摘要

基于深度学习的SEM图像去噪dorin Cerbu1, Sandip Halder1, Philippe Leray11IMEC, Kapeldreef 75, B-3001 Leuven, belgium我们报道了一种利用人工神经网络对SEM图像去噪的新方法的发展。通过使用针对半导体制造中最常见的结构SEM图像的预处理和训练方案,我们可以有效地对受不同程度噪声严重程度和来源影响的图像进行降噪。在下面的图中,我们展示了如何使用该滤波器有效地处理噪声图像并提高图像质量的示例。这有助于获得更稳定和更好的计量数据。图1(a)原始图像(b)使用基于深度学习的算法去噪的图像这一发展对于光刻后处理步骤的情况至关重要,因为扫描电镜检查时,抗蚀剂纳米结构通常受到电子束的影响并收缩,因此扭曲了关键尺寸测量。当我们向n - 10nm节点推进时尤其如此。我们的深度学习处理方案的应用可以有效地对SEM检测图像进行降噪,并帮助我们识别先前被噪声遮蔽的小细节。这是非常重要的,因为我们将在大批量生产中使用EUV。小细节对于理解随机缺陷和工艺缺陷的根本原因是至关重要的。在之前的工作中,我们已经展示了理解随机缺陷的不同方法[1-2]。这项工作的目标是尽可能提高图像质量,以获得对纳米缺陷的进一步基本理解。[1] S. Halder等,“利用机器学习技术理解EUV随机性,SPIE光掩膜技术+极紫外光刻技术,2018[2]K. Sah等。”,“基于先进宽带光学晶圆检测和电子束审查系统的EUV随机缺陷监测”,SPIE光掩膜技术+极紫外光刻技术,2018
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Deep-learning-based SEM image denoiser (Conference Presentation)
Deep-learning-based SEM image denoiser Dorin Cerbu1, Sandip Halder1, Philippe Leray1 1IMEC, Kapeldreef 75, B-3001 Leuven, Belgium We report the development of a new method to denoise SEM images with the help of artificial neural networks. Upon using a preprocessing and training scheme tailored for SEM images of structures, most often encountered in semiconductor manufacturing, we can efficiently denoise images affected with varying degrees of noise severity and origin. In the figure below, we show an example of how we can use this filter efficiently to treat noisy images and improve the image quality. This can help in acquisition of more stable and better metrology data. Fig1(a) original image (b) Image which has been denoised using deep-learning based algorithms This development is of utmost importance for the case of post-litho processing step where resist nanostructures when SEM inspected are usually impacted by the electron beam and shrink, hence skewing critical dimension measurements. This is especially true as we push towards sub N-10 nm nodes. Application of our deep-learning processing scheme allows efficient noise reduction on SEM inspection images and helps us discern minor details previously shadowed by noise. This is extremely important as we move towards using EUV in high volume manufacturing. Small details can be crucial to understand the root-cause of stochastic and process defects. In previous work, we have already shown different approaches to understand stochastic defects [1-2]. The goal of this work is to enhance the image quality as much as possible to gain further fundamental understanding on nano-defects. [1] S. Halder et. al., ‘Using machine learning techniques to understand EUV stochastics, SPIE Photomask Technology + Extreme Ultraviolet Lithography, 2018 [2] K. Sah et.al., ‘EUV stochastic defect monitoring with advanced Broadband optical wafer inspection and e-Beam review systems’, SPIE Photomask Technology + Extreme Ultraviolet Lithography, 2018
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信