在全耗尽SOI CMOS技术中优化器件/电路设计的非局部冲击电离建模

S. Krishnan, J. Fossum
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引用次数: 3

摘要

深亚微米,薄的完全耗尽(TFD) SOI mosfet在未来的ULSI技术中是可行的,它们在低功耗电路中也有潜在的应用。然而,随着它们的大幅缩小,由于冲击电离驱动的寄生BJT,它们的过早击穿和非状态闩锁会威胁到它们的生存能力。这些效应的可靠建模需要对冲击电离进行非局部分析,而传统的局部场分析往往会过度预测载流子产生率。此外,为了在电路级研究上述效应,模型必须紧凑,同时反映潜在的器件物理。在本文中,我们描述了在强反转和弱反转的完全耗尽SOI mosfet中碰撞电离的非局部模型的开发和实现,并讨论了该器件模型在我们的预测电路模拟器SOISPICE-2中的应用,以优化缩放SOI CMOS的设计。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Non-local modeling of impact ionization for optimal device/circuit design in fully depleted SOI CMOS technology
Deep-submicron, thin fully depleted (TFD) SOI MOSFETs are potentially viable for future ULSI technology, and they also have potential applications in low-power circuits. However as they are aggressively scaled down, premature breakdown and off-state latch, attributed to the parasitic BJT driven by impact-ionization, threaten their viability. Reliable modeling of these effects requires a non-local analysis of impact ionization, as opposed to conventional local-field analyses that tend to over-predict the carrier generation rate. Furthermore, to study the mentioned effects at the circuit level, the models have to be compact while reflecting the underlying device physics. In this paper we describe the development and implementation of a non-local model for impact ionization in fully depleted SOI MOSFETs in both strong and weak inversion, and we discuss application of the device model in our predictive circuit simulator SOISPICE-2 to design optimization of scaled SOI CMOS.<>
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