{"title":"多层互连技术和未来对逻辑应用的要求","authors":"M. Brillouet","doi":"10.1557/PROC-514-29","DOIUrl":null,"url":null,"abstract":"As the density of integration of logic functions increases, the performance and cost of the logic ICs is more and more dominated by the interconnection system. While the semiconductor industry was able to stay for a long time with the classical Al/Si0/sub 2/ system, there is a growing trend to move to new interconnect materials.","PeriodicalId":302609,"journal":{"name":"European Workshop Materials for Advanced Metallization,","volume":"16 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Multilevel interconnection technologies and future requirements for logic applications\",\"authors\":\"M. Brillouet\",\"doi\":\"10.1557/PROC-514-29\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"As the density of integration of logic functions increases, the performance and cost of the logic ICs is more and more dominated by the interconnection system. While the semiconductor industry was able to stay for a long time with the classical Al/Si0/sub 2/ system, there is a growing trend to move to new interconnect materials.\",\"PeriodicalId\":302609,\"journal\":{\"name\":\"European Workshop Materials for Advanced Metallization,\",\"volume\":\"16 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"European Workshop Materials for Advanced Metallization,\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1557/PROC-514-29\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"European Workshop Materials for Advanced Metallization,","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1557/PROC-514-29","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Multilevel interconnection technologies and future requirements for logic applications
As the density of integration of logic functions increases, the performance and cost of the logic ICs is more and more dominated by the interconnection system. While the semiconductor industry was able to stay for a long time with the classical Al/Si0/sub 2/ system, there is a growing trend to move to new interconnect materials.
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