荧光粉封装结构对片上荧光粉转换暖白光led光学性能的影响

P. H. Yuen, Hwang Hsien Shiung, M. Devarajan
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引用次数: 5

摘要

研究了三种不同的荧光粉封装方式下,高功率暖白光二极管(ww - led)在片上芯片(COB)封装中的光学性能。所研究的荧光粉结构有远距离荧光粉、双层荧光粉层和正常荧光粉结构。实验数据分析表明,与其他两种荧光粉配置相比,正常荧光粉配置的COB封装中LED样品的效率最高,这与其他LED封装中荧光粉配置的比较研究结果不同。本研究还发现,远端荧光粉配置的LED样品在红黄发射区相对强度最高,而正常荧光粉配置的LED样品在蓝色发射区相对强度最高。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Influence of phosphor packaging configurations on the optical performance of Chip on Board phosphor converted Warm White LEDs
The optical properties of high power Warm-White Light Emitting Diodes (WW-LEDs) in Chip-on-Board (COB) package of Dam-and-Fill encapsulation with three different phosphor packaging configurations were investigated in this paper. The phosphor configurations studied were remote phosphor, double phosphor layers and normal phosphor configuration. Analysis of experimental data shows that LED samples in COB package with normal phosphor configuration had the highest efficiency compared to the other two phosphor configurations, differing from usual results obtained in other comparison studies of phosphor configurations in LED packages. This investigation also shows that LED samples with remote phosphor configuration has the highest relative intensity at red-yellow emission region, while LED samples with normal phosphor configuration has the highest relative intensity at blue emission region.
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