3D集成电路制造的供应链

2012 14th International Conference on Electronic Materials and Packaging (EMAP) Pub Date : 2012-12-01 DOI:10.1109/EMAP.2012.6507848

J. Lau

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引用次数: 3

摘要

本文对3D集成电路制造中的供应链进行了研究。重点放在技术供应链的所有权上，如FEOL(前端生产线)、MOL(中线)、BEOL(后端生产线)、TSV(通硅孔)、MEOL(中线)以及封装组装和测试。将提供一些建议。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Supply chains for 3D IC integration manufacturing

The supply chains for 3D IC integration manufacturing are studied in this investigation. Emphasis is placed on the ownerships of the technology supply chains such as the FEOL (front-end-of-line), MOL (middle-of-the-line), BEOL (back-end-of-line), TSV (through-silicon via), MEOL (middle-end-of-line), and package assembly and test. Some recommendations will be provided.

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2012 14th International Conference on Electronic Materials and Packaging (EMAP)

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