用三点弯曲测试评估扇形圆片级封装强度

2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Pub Date : 2016-07-01 DOI:10.1109/IPFA.2016.7564304

C. Xu, Z. Zhong, W. Choi

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引用次数: 9

摘要

扇出晶圆级封装(FOWLP)变得更有吸引力，因为它可以灵活地将各种器件集成在一个非常小的尺寸中。由于FOWLP由多种材料组成，因此合理的结构和材料设计对于满足可靠性要求至关重要。在本研究中，采用三点弯曲试验方法对不同结构的fowlp的力学性能进行了评价。旨在了解结构因素对包装强度和可靠性的影响。

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Evaluation of Fan-out Wafer Level Package strength by three-point bending testing

The Fan-out Wafer Level Package (FOWLP) becomes more attractive because of its flexibility for integration of diverse devices in a very small form factor. As the FOWLP is composed of various materials, the proper structural and material designs are important to meet reliability requirements. In this study, mechanical properties of FOWLPs with different structures were evaluated by a three-point-bending test method. It aims to understand the effect of structural factors on package strength and its reliability.

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2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

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