Cost savings through innovative and LEAN engineering approach for wireless modules

One of the wireless module required additional Thermal Interface Material (TIM) and Electro Magnetic Interference (EMI) absorber in order for the product to function per requirement. In order to place these two items onto the module, the one piece shield will need to be replaced by 2 pieces shield - shield fence & shield lid. All these additional BOM items will need to be assembled and inspected manually by operators. This resulted in significant increase of cycle time needed for the assembly and inspection process which causes ODM to increase their Manufacturing Value Adder (MVA). Total BOM cost also increased significantly for those three additional items. As the results, Instead of achieving generation product cost reduction, the cost for that generation of wireless products actually went up. This presentation will illustrate the key challenges faced and the approach that we have taken mainly through Process Automation, LEAN waste elimination and Process Shift Left to supplier. These innovative and holistic three phases approach enable huge cycle time reduction (91%) for the additional processes in ODM and achieve significant cost savings across the life cycle of the product.