利用单微米银纳米颗粒的凹凸实现低温低压凹凸键合

2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2014-07-15 DOI:10.1109/LTB-3D.2014.6886186

Weixin Fu, T. Kasahara, A. Okada, S. Shoji, A. Shigetou, J. Mizuno

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引用次数: 0

摘要

在低键合温度和低压应力条件下，实现了一种利用银纳米颗粒形成的单微米凸点的键合方法。凹凸直径为8 μm，间距为16 μm。结合温度为250℃，压应力约为41.4 MPa。进行剪切试验，粘结强度可达5.89 MPa。

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Low temperature and low pressure bump bonding realized by single-micrometer Ag-nanoparticle bumps

A bonding method using single-micrometer bumps, which were formed by Ag nanoparticle, had been realized under low bonding temperature and low compressive stress. The bump diameter is 8 μm and the pitch is 16 μm. The bonding temperature was 250°C under compressive stress of about 41.4 MPa. A shear test was carried out and the strength of the bond could reach 5.89 MPa.

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2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

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